Intelligent Press-Fit Solutions
Precision servo press-fit for 5G, EV, and IGBT modules.
High-Precision Die Bonder Solutions
Advanced precision die bonding solutions for diverse applications.
Testing & Sorting Solutions
Ultra-High Speed & Industry-Leading Precision.
PROBE STATION SYSTEM
High-precision, fast wafer testing with auto-centering and die-sizing.
CHANGE KIT
All Epson model and Multitest MT9510.
POGO PIN
Less worn out.
Less contamination.
Longer life Span.
C3 COATING
Diamond like carbon material, Reduction of Sn transfer.
STAMPED SPRING PROBE
High performance & cost effective with stamping process.
WEE TEST SOCKET
The most cost-effective ultra high performance test socket in the testing field now.
WEE+POGO TEST SOCKET
Probe tips like changeable.
TEECONS
High performance test socket, rolling contact design.
Contact Finger
High power contact finger.
TF+ SUBSTRATE
For new advance probe card, Super fine pitch down to 30um pitch array.
PARIPOSER
BallWire Contacts, Connect Fine Pitch at 50GHz+
RF SYSTEM
High frequency measurement solutions.