WEE TEST SOCKET

The most cost-effective ultra high performance test socket in the testing field now.

POGO PIN

Less worn out.
Less contamination.
Longer life Span.

STAMPED SPRING PROBE

High performance & cost effective with stamping process.
Enabling small diameter for 0.15mm fine pitch.

C3 COATING

Diamond like carbon material.
Reduction of Sn transfer.
High stability contact resistance.

TF+ SUBSTRATE

For new advance probe card
Super fine pitch down to 30um pitch array

TEECONS

High performance test socket, rolling contact design.
Self–cleaning wipe actions create a higher first yield with lighter pad abrasion.

HANDLER

Testing Logic IC handler.
Smart Motion Control robot control technology enables fast movement with low vibration when transferring semiconductors.

TESTER

The Griffin III is superior cost-effective solution for mass production, engineering and failure analysis test applications.

PARIPOSER

BallWire Contacts
Connect Fine Pitch at 50GHz+