POGO PIN
Less worn out.
Less contamination.
Longer life Span.
TEECONS
High performance test socket, rolling contact design.
Self–cleaning wipe actions create a higher first yield with lighter pad abrasion.
STAMPED SPRING PROBE
High performance & cost effective with stamping process.
Enabling small diameter for 0.15mm fine pitch.
C3 COATING
Diamond like carbon material.
Reduction of Sn transfer.
High stability contact resistance.
TESTER
The Griffin III is superior cost-effective solution for mass production, engineering and failure analysis test applications.
HANDLER
Testing Logic IC handler.
Smart Motion Control robot control technology enables fast movement with low vibration when transferring semiconductors.
TF+ SUBSTRATE
For new advance probe card
Super fine pitch down to 30um pitch array
PARIPOSER
BallWire Contacts
Connect Fine Pitch at 50GHz+