SO8

DDPAK Contact

DPAK Contact

SENCE Flat Contact

S-MSOP Contact

S-MSOP Finger

SOIC8 Contact

MICRO 3.3x3.3

SENCE Flat Contact

Features:

• Easy to install.
• Able to tailor to your package/device requirements.
• Follow the existing PCB foot print.
• An Alternative to loose Contact Finger solution.
• Ganged finger design to improve finger alignment.
• Non Kelvin & Kelvin Test