Ultimate Precision for Complex Packaging

• Performance: Achieve placement accuracy of $\pm 5\mu m@3\sigma$ and angular control within ±0.1∘@3σ
• Key Features:

Equipped with a precision air-bearing force control system (10~1000gf) to handle fragile components with care.

Dust-proof design: Standard Class 1000, with an option for Class 100 cleanroom environments.

• Applications: SiP, TR modules, DC/AC, microwave components, and optical modules

High-Temperature Reliability for Power Devices

• Performance: Accuracy of $\pm 7\mu m@3\sigma$ with a throughput of 1000 CPH.
• Key Features:

Integrated clip-type rail heating system including preheating, heating, and cooling zones.

Supports high-temperature processes up to 450°C.

• Applications: Microwave RF devices, detectors, and high-power LED electronics.

Mass Production for Next-Gen Memory

• Performance: Ultra-high throughput of up to 6000 CPH (at 50ms process time) with $\pm 7\mu m$ precision.
• Key Features:

Optimized for Logic/Flash/DRAM memory chip stacking.

Compatible with 8" and 12" wafer rings.

• Applications: High-density storage chip stacking and advanced memory packaging.

Technical Specifications at a Glance

Our Core Technology Advantage

Topleading Intel machines are built on Six Core Technologies that ensure long-term stability and high yield:

• Precision Mechanics: Utilizing high-precision platforms and high-speed Pick & Place (P&P) systems.
• Advanced Simulation: Designs are validated through statics, thermodynamics, and vibration simulations to eliminate mechanical errors.
• Software Intelligence: Integrated HMI with AI Large Models for smarter image processing and module decoupling

HEAD OFFICE

Taoyuan (Taiwan)

Phone: +886-3-3557608
Fax: +886-3-3557205
Email: sales@tekcrown.com

Irvine (USA)

Phone: +1-949-436-3785
Fax: +1-949-536-5392
Email: sales@tekcrown.com