We provide a complete product line for high-precision servo press-fit equipment, primarily focusing on 5G communications, new energy, automotive electronics, and IGBT modules.

Core Product Series

  • Model Type  MCP-3T
  • Press Force  3 Tons
  • Max PCB Size  460L x 610W
  • AutomationLevel Manual Mold Change
  • Best Use Case  Small modules|automotive electronics
  • Model Type  MCP-10T
  • Press Force  5 Tons
  • Max PCB Size  630L x 800W
  • AutomationLevel Manual Mold Change
  • Best Use Case  Servers|high-force applications

 

  • Model Type  SCP-5T
  • Press Force  5 Tons
  • Max PCB Size  700L x 700W
  • AutomationLevel Auto Mold Change
  • Best Use Case  Mass production with manual loading
  • Model Type  ACP-3T
  • Press Force  3 Tons
  • Max PCB Size  800L x 700W
  • AutomationLevel Inline Full Auto
  • Best Use Case High-volume production with conveyors

 

Key Technical Advantages

  • Superior H-Type Frame Structure: Our machines utilize an H-type structure consisting of two vertical frames and two horizontal bars. This design provides extreme rigidity and resists deformation, ensuring ram verticality and pressing accuracy even for large-scale circuit boards
  • Closed-Loop Servo Drive Control: Features a full-process closed-loop servo system that monitors pressure, distance, and speed in real-time. This precise control prevents over-pressing or under-pressing, ensuring high-quality results for delicate components
  • Intelligent Bent Pin Detection: Integrated high-precision pressure sensors can detect premature contact with the connector. If a bent or misaligned pin is sensed, the machine stops immediately to protect expensive modules from damage.
  • Air-Floating Press Head: Our innovative air-floating design allows for 360° pressing at any angle on the PCB. It utilizes compressed air to create a floating gap, providing automatic correction if a connector is slightly misaligned during entry
  • Smart Mold Storage & Recognition: The SCP and ACP series feature a mold rack that stores up to 13 different molds. Each mold carrier has a unique identity recognized by a vision system, reducing line changeover time by 80% and doubling pressing efficiency
  • Optional Two-Stage Press Force: Supports a secondary small-force sensor (5-2000N) specifically designed to sense the feedback force as the mold enters the connector, providing total protection for high-end connectors

     Industry 4.0 & Digital Management

  • User-Friendly Interface: Features a touch-screen interface with multi-language support (Chinese/English). The software is highly intelligent, automatically assigning default parameters based on connector size and required force
  • Full Data Traceability: Our systems are Industry 4.0 ready, allowing seamless connection to MES systems. All pressing data curves can be stored locally or uploaded to a server for comprehensive quality tracking and accessory lifespan monitoring

CONTACT US

 
HEAD OFFICE
Taoyuan (Taiwan)

Phone: +886-3-3557608
Fax: +886-3-3557205
Email: sales@tekcrown.com


Irvine (USA)

Phone: +1-949-436-3785
Fax: +1-949-536-5392
Email: sales@tekcrown.com







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